CelLink
High-conductance, large-area flexible circuits
for the clean power revolution
Device stacks engineered for superior thermal, mechanical, and electrical performance
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Unique dielectric materials for high speed data transmission, low stiffness, fire retardancy, and more
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Patterned adhesive backings and back-bared metal structures ensure ease of assembly for end users
Up to 2m x 1m part footprint
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Coming soon: 3.5m x 1m
Copper thickness 17.5 - 250 µm
Aluminum thickness 17.5 - 500 µm
Multi-layer conductor assemblies available
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Aluminum conductors available with proprietary coatings that provide a highly reliable solderable surface
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Other metals, alloys, and tempers available upon request
CelLink’s high-conductance circuits integrate busing, fusing, voltage monitoring, and temperature monitoring wiring systems into a single circuit.
CelLink’s circuits provide much greater control over power and data transmission than traditional round wire – at 1/4th the weight and 1/10th the volume.
Thanks to a completely tool-less manufacturing process, CelLink’s minimum order quantity is one.
View Details
CelLink’s high-conductance circuits integrate busing, fusing, voltage monitoring, and temperature monitoring wiring systems into a single circuit.
CelLink’s circuits provide much greater control over power and data transmission than traditional round wire – at 1/4th the weight and 1/10th the volume.
Thanks to a completely tool-less manufacturing process, CelLink’s minimum order quantity is one.
View Details