Battery Pack Interconnect

The Ultimate Pack Wiring Solution

CelLink’s high-conductance circuits integrate busing, fusing, voltage monitoring,
and temperature monitoring wiring systems into a single circuit.

Battery Interconnect

Circuit construction

A typical CelLink battery circuit construction might include:

  • 50-125 µm thick flame-retardant PEN coverlay or FRB paper dielectric
  • 100-1000 µm thick aluminum  busing conductor(s)
  • 70-125um thick aluminum  cell contacting layer
  • 50-125 µm thick flame-retardant PEN coverlay or FRB paper (optional)

Benefits

CelLink battery circuits are best-suited to interconnecting large arrays of small battery cells via laser welding. Under natural convection conditions, a 400 µm thick aluminum battery circuit can transmit approximately 30 amps per centimeter of bus width with less than 20 °C temperature rise; in most cases, cell and bus geometry may be optimized to stay well below this figure of merit.

  • Full control over small features in the circuit and therefore current distribution allowing for more range in the vehicle
  • More Z-Height available for battery cooling
  • Cell-agnostic
  • Variants with no additional tooling cost
  • Multi-layer conductors
  • Mass Reduction

Fuse features

CelLink’s process allows for the production of fuse features with controlled fuse currents over the range 5-150 amps. Please contact us for guidance regarding fuse sizing.

BMS connection

Connection to the BMS board is possible through surface mount connectors, laser or ultrasonically welded terminals/connectors or direct attached to PCB .

Ease of assembly

As with other applications, a thin adhesive layer may be applied to the circuit to facilitate heat transfer from the battery cells through the circuit to an affixed heat sink.

From rapid prototype to high volume

CelLink’s battery circuits require no hard tooling for fabrication. This implies that CelLink’s circuit designs can not only be rapidly iterated upon through the prototyping phase of product development, they can also be adapted to a wide variety of different cell geometries – all without incurring large capital expenditures early in the life cycle of new pack development.